| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip type circuit protection element capable of improving a quick action property of fusion by overcurrent, and having a sufficient protection effect. SOLUTION: A base glass layer 2 is stacked on a surface of an insulating substrate 1, and a pair of metal layers 9 are arranged on both its end sides so that outer ends thereof are positioned inside the ends of the base glass layer 2. A fuse element 4 is composed of a pair of wide electrode parts 4b arranged to cover the metal layers 9, and a narrow fusion part 4a connecting the electrode parts 4b to each other. A glass layer 5 is formed to cover the fusion part 4a, and a protective resin layer 6 is formed on top of it. The metal layers 9 are located right under both ends of the protective resin layer 6. End face electrodes 7 each formed so that at least a part thereof is stacked on the electrode part 4b, and parent solder layers 8 covering them are formed on the end faces of the insulating substrate 1. The end face electrodes 7 are not directly connected to the metal layers 9. COPYRIGHT: (C)2008,JPO&INPIT
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