| 摘要 |
A purge system for a chamber in a semiconductor fabricating apparatus is provided to avoid generation of particles on the inner wall of a buffer chamber or a loadlock chamber caused by predetermined gas used in a wafer etch process by previously blocking introduction of gas into the buffer chamber or the loadlock chamber. A gas line(20) is installed at a wafer transfer port(10) of a buffer chamber(120). A plurality of injection nozzles(30) are installed along the gas line so that purge gas in the gas line is injected toward the port of the buffer chamber. While the port of the buffer chamber is opened, the purge gas in the gas line is injected toward the port through the injection nozzle by a control unit including an actuator, an open/close valve and a solenoid valve. The actuator supplies power for opening/closing to the port of the buffer chamber. The open/close valve is installed in the gas line. The solenoid valve converts the open/close valve into an open state when opening power is supplied to the port through the actuator, and returns the open/close valve to a closed state when closing power is supplied to the port through the actuator. The purge gas can be nitrogen gas.
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