PROCESS FOR PRECISION PLACEMENT OF INTEGRATED CIRCUIT OVERCOAT MATERIAL
摘要
The invention provides a process (100) for manufacturing an integrated circuit (IC) package and an integrated circuit (IC) package. The process, without limitation, includes providing an integrated circuit chip having a configuration, and forming a layer of overcoat material over the integrated circuit chip (110) based upon the configuration.
申请公布号
WO2008021860(A2)
申请公布日期
2008.02.21
申请号
WO2007US75437
申请日期
2007.08.08
申请人
TEXAS INSTRUMENTS INCORPORATED;PIRKLE, REX, W.;MALOLEPSZY, SEAN, M.