发明名称 |
Method for polishing a substrate surface |
摘要 |
According to one aspect of the invention, an improved process for preparing a surface of substrate is provided wherein the surface of the substrate is prepared for a chemical mechanical polishing (CMP) process, the CMP process is performed on the surface of the substrate, and the surface of the substrate is finished to clear the substrate surface of any active ingredients from the CMP process. Also, an improved substrate produced by the method is provided. According to one aspect of the invention, particular polishing materials and procedures may be used that allow for increased quality of AlN substrate surfaces.
|
申请公布号 |
US7323414(B2) |
申请公布日期 |
2008.01.29 |
申请号 |
US20060363816 |
申请日期 |
2006.02.28 |
申请人 |
CRYSTAL IS, INC.;RENSSELAER POLYTECHNIC INSTITUTE |
发明人 |
SCHOWALTER LEO J.;LOPEZ JAVIER MARTINEZ;ROJO JUAN CARLOS;MORGAN KENNETH |
分类号 |
H01L21/461;B24B37/04;C09G1/02;H01L21/02;H01L21/302;H01L21/304;H01L21/306 |
主分类号 |
H01L21/461 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|