| 摘要 |
A MICROELECTROMECHANICAL SYSTEM (32) MEY BE ENCLOSED IN A HERMETIC CAVITY (44) DEFINED BY JOINED, FIRST AND SECOND SEMICONDUCTOR STRUCTURES (14, 12). THE JOINED STRUCTURES (14, 12) MAY BE SEALED BY A SOLDER SEALING RING (18), WHICH EXTENDS COMPLETELY AROUNS THE CAVITY (44). ONE OF THE SEMICONDUCTOR STRUCTURES (14, 12) MAY HAVE THE SYSTEM (32) FORMED THEREON AND AN OPEN AREA (38) MAY BE FORMED UNDERNEATH SAID SYSTEM (32). THAT OPEN AREA (38) MAY BE FORMED FROM THE UNDERSIDE OF THE STRUCTURE (14, 12) AND MAY BE CLOSED BY COVERING WITH A SUITABLE FILM A SUITABLE FILM (20) IN ONE EMBODIMENT.(FIG 1) |
