| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of transmitting a signal without increasing the number of through-holes even when many through wires are required in the case of transmitting a signal, by using through wires formed in a through-hole formed on a substrate so as to be pierced from the surface of the substrate to the rear; and to provide a manufacturing method of the semiconductor device. <P>SOLUTION: In the semiconductor device constituted of mounting a semiconductor chip 10C on a substrate 10A; a plurality of wires 43a, 43b from the semiconductor chips are formed in the through-hole pierced through the substrate 10A, and these through wires 43a, 43b are drawn out to the other surface side of the substrate 10A. Since many wiring lines for signal transmission can be secured by the plurality of through wires formed in each through-hole, it is unnecessary to increase the number of through-holes. <P>COPYRIGHT: (C)2008,JPO&INPIT |
