| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in moldability such as flowability, little occurrence of resin burr, etc., and in reliability on moisture resistance, etc., and to provide a package for an electronic component device, as well as an electronic component device. <P>SOLUTION: The epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, and (C) an inorganic moisture absorbent which comprises an inorganic moisture absorbent (C1) whose average particle diameter is at least 15 μm and not more than 70 μm. <P>COPYRIGHT: (C)2008,JPO&INPIT |
