发明名称 |
HIGH-FREQUENCY MODULE |
摘要 |
It is an object of the present invention to provide a high-frequency module whose production yield as a complete module can be prevented from being lowered. <??>The high-frequency module according to the present invention includes a main module including a first high-frequency circuit at least a part of which is constituted by a conductive pattern built in a multi-layered substrate and a sub-module including a second high-frequency circuit, and the sub-module is inserted into a cavity formed in the main module. According to the present invention, the main module including the first high-frequency circuit and the sub-module including the second high-frequency circuit are constituted as separate components and the main module and the sub-module are integrated by inserting the sub-module into the cavity formed in the main module. Therefore, it is possible to use only a main module and sub-module that have been inspected after manufacture and found to be non-defective. Accordingly, it is possible to markedly increase the yield of the high-frequency module as a whole. <IMAGE> |
申请公布号 |
EP1381258(A4) |
申请公布日期 |
2007.11.21 |
申请号 |
EP20020713202 |
申请日期 |
2002.03.27 |
申请人 |
TDK CORPORATION |
发明人 |
NAKAI, SHINYA,;YAMASHITA, YOSHINARI;NINOMIYA, HIDEAKI |
分类号 |
H05K1/14;H01L23/13;H01L23/498;H01L23/552;H01L23/66;H01L25/00;H03B5/18;H03H9/72;H04B1/38;H04B1/40;H04B1/48;H05K1/02;H05K1/03;H05K1/18;H05K3/46 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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