| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for simply manufacturing a light-emitting device while minimizing the occurrence of a short circuit when a light-emitting element is coated with glass. <P>SOLUTION: A sheet-like glass member is provided on an LED substrate via an adhesive layer after preparing the LED substrate. Next, the LED substrate is diced together with the glass member so as to form a plurality of LED chips. After mounting the LED chips onto a wiring substrate, the glass member is melted by heat treatment so as to coat the LED chips with the glass member. It is possible to use ethylcellulose or nitrocellulose for the adhesive layer. <P>COPYRIGHT: (C)2008,JPO&INPIT |
