SOLDER RESIST MATERIAL, WIRING BOARD USING THE SOLDER RESIST MATERIAL, AND SEMICONDUCTOR PACKAGE

摘要

This invention provides a solder resist material, which, even when used in a thin wiring board, can suppress the warpage of a semiconductor package upon exposure to heat or impact and meet a demand for a size reduction in electronic equipment and a higher level of integration, and a wiring board using the solder resist material and a semiconductor package. The solder resist material can effectively suppress the warpage of a semiconductor package through the provision of a fiber base material-containing layer between the resin layers. The fiber base material-containing layer is preferably unevenly distributed in the thickness-wise direction of the solder resist material.