| 发明名称 |
Organic encapsulant compositions for protection of electronic components |
| 摘要 |
An organic encapsulant composition applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards allows the capacitor to resist printed wiring board chemicals and pass 1000 hours of accelerated life testing conducted under high humidity, elevated temperature and applied DC bias.
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| 申请公布号 |
US2007236859(A1) |
申请公布日期 |
2007.10.11 |
| 申请号 |
US20060401149 |
申请日期 |
2006.04.10 |
| 申请人 |
BORLAND WILLIAM J;DUEBER THOMAS E;SUMMERS JOHN D;RENOVALES OLGA L;MAJUMDAR DIPTARKA |
发明人 |
BORLAND WILLIAM J.;DUEBER THOMAS E.;SUMMERS JOHN D.;RENOVALES OLGA L.;MAJUMDAR DIPTARKA |
| 分类号 |
H01G2/00;H05K1/16 |
主分类号 |
H01G2/00 |
| 代理机构 |
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