发明名称 |
Capacitor Film Forming Material |
摘要 |
Provided is a novel capacitor film forming material having a high growth rate and excellent step coverage, and obtained is a hafnium-containing film having excellent characteristics as a capacitor film with a high dielectric constant and a low reactivity with Si. A capacitor film forming material comprising a hafnium oxide film provided in a semiconductor memory device, is a capacitor film forming material in which the forming material comprises the organic hafnium compound of Hf(R<SUP>1</SUP>R<SUP>2</SUP>N)<SUB>4 </SUB>or Hf(OR<SUP>3</SUP>)<SUB>4-n</SUB>(R<SUP>4</SUP>)<SUB>n </SUB>and the content of Nb as an inevitable compound is 1 ppm or less.
|
申请公布号 |
US2007231251(A1) |
申请公布日期 |
2007.10.04 |
申请号 |
US20050570092 |
申请日期 |
2005.06.10 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
ITSUKI ATSUSHI;YANAGISAWA AKIO;SOYAMA NOBUYUKI |
分类号 |
H01L21/316;C23C16/40;H01L21/02;H01L21/314;H01L21/8242;H01L27/108 |
主分类号 |
H01L21/316 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|