发明名称 Capacitor Film Forming Material
摘要 Provided is a novel capacitor film forming material having a high growth rate and excellent step coverage, and obtained is a hafnium-containing film having excellent characteristics as a capacitor film with a high dielectric constant and a low reactivity with Si. A capacitor film forming material comprising a hafnium oxide film provided in a semiconductor memory device, is a capacitor film forming material in which the forming material comprises the organic hafnium compound of Hf(R<SUP>1</SUP>R<SUP>2</SUP>N)<SUB>4 </SUB>or Hf(OR<SUP>3</SUP>)<SUB>4-n</SUB>(R<SUP>4</SUP>)<SUB>n </SUB>and the content of Nb as an inevitable compound is 1 ppm or less.
申请公布号 US2007231251(A1) 申请公布日期 2007.10.04
申请号 US20050570092 申请日期 2005.06.10
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 ITSUKI ATSUSHI;YANAGISAWA AKIO;SOYAMA NOBUYUKI
分类号 H01L21/316;C23C16/40;H01L21/02;H01L21/314;H01L21/8242;H01L27/108 主分类号 H01L21/316
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