发明名称 THERMAL INTERFACE MATERIAL WITH MULTIPLE SIZE DISTRIBUTION THERMALLY CONDUCTIVE FILLERS
摘要 <p>A thermal interface material including a matrix and a thermally conductive filler. The thermally conductive filler includes first and a second thermally conductive particulate materials having different particle size distribution. A maximum particle size of the thermally conductive filler may be established by excluding particles having a size greater than a predetermined particle size from the thermally conductive filler.</p>
申请公布号 EP1839469(A2) 申请公布日期 2007.10.03
申请号 EP20060817447 申请日期 2006.11.01
申请人 TECHFILM, LLC 发明人 CANALE, PHILIP, L.;CLARK, GARRETT, L.
分类号 H05K7/20 主分类号 H05K7/20
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