发明名称 |
THERMAL INTERFACE MATERIAL WITH MULTIPLE SIZE DISTRIBUTION THERMALLY CONDUCTIVE FILLERS |
摘要 |
<p>A thermal interface material including a matrix and a thermally conductive filler. The thermally conductive filler includes first and a second thermally conductive particulate materials having different particle size distribution. A maximum particle size of the thermally conductive filler may be established by excluding particles having a size greater than a predetermined particle size from the thermally conductive filler.</p> |
申请公布号 |
EP1839469(A2) |
申请公布日期 |
2007.10.03 |
申请号 |
EP20060817447 |
申请日期 |
2006.11.01 |
申请人 |
TECHFILM, LLC |
发明人 |
CANALE, PHILIP, L.;CLARK, GARRETT, L. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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