Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier

摘要

To produce an ultra-thin copper foil with a carrier foil that microscopic crystal grains can be deposited without being affected by the surface roughness of a carrier foil, etching can be performed until an ultrafine width such that line/space is 15 µm or less, and the microscopic line and a wiring board have large peel strength even after line of 15 µm is etched. An ultra-thin copper foil wherein a carrier foil (1), a peeling layer (2), an ultra-thin copper foil (4) are laminated in this order, the ultra-thin copper foil (4) (before roughening treatment is performed) is an electrolytic copper foil that surface roughness of 2.5 µm as ten point height of roughness profile, and the minimum distance between peaks of salients of a based material is 5 µm or more. Moreover, the surface of the ultra-thin copper foil is performed roughening treatment (5).