| 摘要 |
A method for forming a structured film molded by a tape die is provided to prevent adhesive resin from being stuck on a roller by forming a structured pattern on a tape instead of a rotary die or a die roller, to increase the life time of manufacturing equipment, and to secure stable quality of the film. A method for forming a structured film molded by a tape die(63) comprises the steps of: forming a curable adhesive resin layer(4) on a base layer(2) by coating the base layer with curable adhesive resin selected from a group comprising photocuring adhesive resin and thermosetting adhesive resin; molding or forming a structured pattern(64) on the adhesive resin layer by using the tape die having the structured pattern; and hardening the curable adhesive resin layer formed on the base layer to obtain the layered film having the structured pattern stably formed on the adhesive resin layer and the adhesive resin layer firmly bonded with the base layer.
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