发明名称 |
Electronic component mounting structure |
摘要 |
An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
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申请公布号 |
US2007193774(A1) |
申请公布日期 |
2007.08.23 |
申请号 |
US20070707958 |
申请日期 |
2007.02.20 |
申请人 |
DENSO CORPORATION |
发明人 |
ITO ATSUSHI;HONDA TAKAYOSHI;MIKURA HIDEHIRO;TSURUZAWA TADASHI;SAKUTA TAKUYA |
分类号 |
H05K1/16;H05K7/00 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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