发明名称 |
RELEASABLE RESIN COMPOSITION, MOLDED OBJECT THEREOF, AND LAYERED PRODUCT |
摘要 |
<p>A releasable resin composition which has excellent thermal stability during extrusion molding, etc., does not cause problems such as fuming and foaming during compound preparation or extrusion molding, and does not foul metallic rolls. It can form a release layer which, when contacted with a pressure-sensitive adhesive layer, is free from a problem that an impurity migrates from the release layer to reduce pressure-sensitive adhesive performance. The releasable resin composition comprises a release agent (A) comprising as the main component a polymer having a C<SUB>8-30</SUB> aliphatic group and having a weight-average molecular weight of 10,000-1,000,000 and a thermoplastic polymer (B) comprising constituent units derived from an olefin monomer and/or a polar monomer, the content of the release agent (A) being 0.1-20 parts by weight per 100 parts by weight of the thermoplastic polymer (B). The release agent (A) has a 2% weight loss temperature as determined by thermogravimetric analysis in a 260-275°C region, excluding 275°C, and a 5% weight loss temperature in a 275-330°C region, excluding 330°C.</p> |
申请公布号 |
WO2007088846(A1) |
申请公布日期 |
2007.08.09 |
申请号 |
WO2007JP51482 |
申请日期 |
2007.01.30 |
申请人 |
NITTO DENKO CORPORATION;SAITOU, MAKI;KANAI, SHINICHIROU;SEKI, MOTOHIRO;YAMAMOTO, SATORU;HANAKI, IKKOU;HAYASHI, KEIJI;OKUMURA, KAZUHITO |
发明人 |
SAITOU, MAKI;KANAI, SHINICHIROU;SEKI, MOTOHIRO;YAMAMOTO, SATORU;HANAKI, IKKOU;HAYASHI, KEIJI;OKUMURA, KAZUHITO |
分类号 |
B29C33/62;B29C33/68;B32B27/00;B32B27/32;C08L23/00;C09J7/00 |
主分类号 |
B29C33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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