| 摘要 |
PROBLEM TO BE SOLVED: To protect the terminals formed on the side opposite to the surface of a substrate, on which a semiconductor chip is mounted in the packaging process. SOLUTION: The surfaces with the terminals formed thereon opposite to the sides of the individually dividable multi-boards 12a, with the semiconductor chips 11 being mounted thereon are removably bonded together with adhesive tape 21. Die bonding, wire bonding, and molding are carried out for the individually dividable multi-boards 12a, in a state where the individually dividable multi-boards 12a are bonded together. In some cases, the individually dividable multi-boards 12a may be bonded together with a rigid reinforcing material 22, such as a metal plate 22a for reinforcing the rigidity of the multi-boards 12a that is interposed between them. Thereafter, when they are divided individually, the bonded state thereof is released. COPYRIGHT: (C)2007,JPO&INPIT
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