| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which is satisfactory in moldability such as flowability and hardening property, and in coloring property, and is free from the occurrence of a short-circuit defect due to a conductive material even being used for a package narrow in distance between pads or wires, and an electronic part device provided with an element sealed with the same. SOLUTION: The molding material for sealing epoxy resin contains an epoxy resin (A), a hardening agent (B), and a coloring agent resin mixture (C) formed by previously mixing a resin (C1) and a coloring agent (D) having specific resistance of 1×10<SP>5</SP>Ωcm or higher. COPYRIGHT: (C)2007,JPO&INPIT |
