| 摘要 |
A semiconductor device comprising a semiconductor wafer, a base electrode soldered to one face of the wafer, a first conductive block secured to the base electrode, a second conductive block being in slidable contact with the other face of the wafer, an annular insulator soldered to the first conductive block, a flexible sheet being so secured to the annular insulator as to seal the wafer off from the atmosphere, and means for compressing the conductive blocks to the wafer, characterized in that a hard and thin metallic film is formed on the surface of the second conductive block, whereby a sticking caused between the second conductive block and the wafer can be prevented.
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