APPARATUS FOR TREATING SUBSTRATES

摘要

A substrate processing apparatus is provided to uniformly maintain density distribution of a dry fluid and to prevent contamination of a foreign substance on a substrate by indirectly spraying the dry fluid onto the substrate. A substrate supporting member(110) has a chuck(112) where a substrate(W) is located. A low chamber(120) whose upper portion is opened wraps around the chuck. An upper chamber(130) opens or shuts the upper portion of the low chamber so that a dry process for the substrate is performed in an isolation state from the outside. An indirect spray nozzle(140) is installed at an edge of the upper chamber. The indirect spray nozzle sprays a dry fluid toward the center of the upper chamber so that the dry fluid is indirectly sprayed onto the substrate. The upper chamber includes an air current inducing member(139) on the center thereof. The air current inducing member guides the flow of the dry fluid so that the dry fluid sprayed from the indirect spray nozzle firstly reaches to the center of the substrate.