Method of producing power semiconductor module and such a module in a carrier has pressure element in carrier during and after filling inner space with plastic and hardening

摘要

A method of producing a power semiconductor module comprising at least one semiconductor component in a carrier (2) in a closed form comprises pressing the carrier against an inner wall of the shape by a pressure element (14) while being filled with plastic. The pressure element remains in the power semiconductor module during and after the hardening of the plastic. An independent claim is also included for a power semiconductor module produced as above.