Semiconductor wafer and method of fabricating an IC die

摘要

There is provided a semiconductor wafer comprising a plurality of replicated IC modules. Each replicated IC module is capable of forming an individual IC die. The semiconductor wafer further comprises inter-module cross-wafer electrical connections, and the replicated IC modules are further arranged to be cut into IC dies comprising multiple replicated IC modules.;There is further provided a method of fabricating an IC die. The method comprises fabricating such a semiconductor wafer, determining a required configuration of replicated IC modules, identifying inter-module boundaries along which to cut the semiconductor wafer to achieve the required configuration of replicated IC modules, and cutting the semiconductor wafer along the identified inter-module boundaries to produce at least one IC die comprising the required configuration of replicated IC modules.

主权项

1. A semiconductor wafer comprising a plurality of replicated integrated circuit, IC, modules, each replicated IC module capable of forming an individual IC die;
wherein the semiconductor wafer further comprises inter-module cross-wafer electrical connections and the replicated IC modules are further arranged to be cut into IC dies comprising multiple replicated IC modules.