发明名称 Cooling medium for electronic components, comprises high thermal conductivity, high breakdown resistance, is chemically inert, and has good thermal stability
摘要 <p>A cooling system for use in electronic units, comprises high thermal conductivity (at least 20 times that of water) and a high breakdown resistance (higher than glass or rubber). The medium is chemically inert and is stable between -30 and 150 deg C. It is insoluble and its viscosity only has small temperature dependance.</p>
申请公布号 DE102005037342(A1) 申请公布日期 2007.04.12
申请号 DE20051037342 申请日期 2005.08.04
申请人 LIQUIDSI TECHNOLOGIES GMBH & CO.KG 发明人 GRUHN, PATRICK
分类号 C09K5/08;G06F1/20;H05K7/20 主分类号 C09K5/08
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