发明名称 |
Cooling medium for electronic components, comprises high thermal conductivity, high breakdown resistance, is chemically inert, and has good thermal stability |
摘要 |
<p>A cooling system for use in electronic units, comprises high thermal conductivity (at least 20 times that of water) and a high breakdown resistance (higher than glass or rubber). The medium is chemically inert and is stable between -30 and 150 deg C. It is insoluble and its viscosity only has small temperature dependance.</p> |
申请公布号 |
DE102005037342(A1) |
申请公布日期 |
2007.04.12 |
申请号 |
DE20051037342 |
申请日期 |
2005.08.04 |
申请人 |
LIQUIDSI TECHNOLOGIES GMBH & CO.KG |
发明人 |
GRUHN, PATRICK |
分类号 |
C09K5/08;G06F1/20;H05K7/20 |
主分类号 |
C09K5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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