| 发明名称 |
ELECTRICAL CONTACT ENCAPSULATION. |
| 摘要 |
<p>An electronic device (500) comprises a substrate (510) and an electrical contact(520) in contact with the dielectric layer (544) and electrically coupled withat least one resistor (518), a substrate carrier (540) including an electricaltrace (542) electrically coupled to the electrical contact (520), a polymer(524) enclosing the electrical contact (520), and a substantially planar film(528) disposed over the electrical contact (520).</p> |
| 申请公布号 |
MX2007001370(A) |
申请公布日期 |
2007.04.10 |
| 申请号 |
MX20070001370 |
申请日期 |
2005.07.22 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
BRAD BENSON;FRANK J. BRETI;ELLEN L. CHAPPELL;JEFFERY M. IGELMAN;STEVE H. ZHANG |
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