发明名称 Improved tin plating method
摘要 A method for plating tin or a tin alloy on a substrate such that whiskers are prevented from forming or the number of whiskers is reduced in number as well as size.
申请公布号 EP1477587(A3) 申请公布日期 2007.04.04
申请号 EP20040252548 申请日期 2004.04.30
申请人 ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. 发明人 WHITLAW, KEITH J.;TOBEN, MICHAEL P.;EGLI, ANDRE;CROSBY, JEFFREY N.;ROBINSON, CRAIG S.
分类号 C25D3/30;C25D5/26;C25D3/38;C25D5/02;C25D5/10;C25D5/34;C25D7/00;H01L23/50;H05K3/24;H05K3/38 主分类号 C25D3/30
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