A device package that includes a thin film getter that is deposited on an inside surfaces of a device receiving vacuum sealed cavity or chamber. The thin film getter is deposited using, for example, sputtering, resistive evaporation, e-beam evaporation, or any other suitable deposition technique.
申请公布号
EP1751029(A1)
申请公布日期
2007.02.14
申请号
EP20050749763
申请日期
2005.05.13
申请人
HONEYWELL INTERNATIONAL INC.
发明人
DCAMP, JON, B.;KOLAND, LISA, P.;GLENN, MAX, C.;CURTIS, HARLAN, L.