发明名称 SHEET TO FORM A PROTECTIVE FILM FOR CHIPS AND PROCESS FOR PRODUCING SEMICONDUCTOR CHIPS
摘要 The present invention provides a sheet (10) to form a protective film for chips, which can be readily formed into a highly uniform protective film on a back surface of chip, and which, even if minute scratches are formed on the back surface of chip as a result of mechanical grinding, can eliminate adverse effects resulting from the scratches. <??>The sheet (10) to form a protective film for chips of the present invention comprises a release sheet (1) and a protective film forming layer (2) formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises a thermosetting or energy ray-curable component and a binder polymer component. <IMAGE>
申请公布号 KR100681665(B1) 申请公布日期 2007.02.09
申请号 KR20020014961 申请日期 2002.03.20
申请人 发明人
分类号 C09J7/00;H01L23/48;C09J133/00;C09J163/00;H01L21/301;H01L21/58;H01L21/68;H01L21/78;H01L23/00;H01L23/31 主分类号 C09J7/00
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