| 摘要 |
<p>PROBLEM TO BE SOLVED: To accurately detect incomplete cutting when a sticky tape is cut by a tape cutter along a frame in a taping device for integrating a semiconductor wafer which is, for example, a workpiece with the ring-like frame for supporting, carrying and processing it by the sticky tape. SOLUTION: In a taping method for integrating a workpiece with a frame 80 by a sticky tape 2, the workpiece and frame 80 are chucked and supported by a specific holding part and the sticky tape 2 is stuck, and a circuit 35, which energizes by the contact of a tape cutter 31 for cutting the sticky tape along the frame 80 with the frame 80 held by the frame holding part is constituted so that, uncutting of tapes is detected by a fact that, during tape cutting by the tape cutter 31, the circuit 35 comes out of continuity.</p> |
