| 发明名称 |
Solder composition for electronic devices |
| 摘要 |
Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds. |
| 申请公布号 |
US2007031279(A1) |
申请公布日期 |
2007.02.08 |
| 申请号 |
US20060399856 |
申请日期 |
2006.04.07 |
| 申请人 |
RENESAS TECHNOLOGY CORPORATION |
发明人 |
SOGA TASAO;SHIMOKAWA HANAE;NAKATSUKA TETSUYA;MIURA KAZUMA;NEGISHI MIKIO;NAKAJIMA HIROKAZU;ENDOH TSUNEO |
| 分类号 |
C22C9/02;H01L21/50;H01L21/56;H01L21/60;H01L23/10;H01L23/31;H01L23/367;H01L23/433;H01L23/485;H01L23/492;H01L23/495;H05K1/14;H05K3/34 |
主分类号 |
C22C9/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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