Apparatus and method for plating a metal plating layer onto a surface of a seed layer of a wafer

摘要

An object of the present invention is to provide a wafer cleaning apparatus for cleaning wafers that have received various processing such as copper plating and chemical mechanical polishing. An apparatus for cleaning front and back surfaces of a wafer (W) with solution while rotating the wafer (W) that has been subjected to a fabrication process, said apparatus comprises: cleaning nozzles (31,33) for spraying a cleaning solution, respectively, to a front surface of the wafer (W) that has been processed and to a back surface thereof; and an etching nozzle (35) for spraying an etching solution to a vicinity of the outer periphery of the wafer (W). <IMAGE>