| 摘要 |
An apparatus and a method for processing a substrate are provided to shorten the time for removing a material layer, by partially processing the material layer using dry ice particles, and then removing the processed material layer through cleaning and etching. A loading unit is configured to load a substrate(10), on which a material layer is formed. A dry ice supplying unit(30) stores and supplies dry ice particles. A spray processing unit(40) includes one or more nozzles, wherein the spray processing unit surface-processes the material layer by spraying dry ice particles, which are supplied from the dry ice supplying unit, on the substrate. A surface processing unit selectively removes the surface-processed material layer. |
