发明名称 Spring mechanism and cell contact mechanism for small electronic device
摘要 In a cell cover according to the present invention, a compressed coil spring formed by deforming a linear elastic member is fixed to a plate member provided with a raised bent portion as a projection on a first side. The raised bent portion engages with an engagement part comprising a plurality of extended portions and bent portions of the compressed coil. A spring of the compressed coil is formed on a second side of the plate member. A spring seat winding at the bottom of the spring is pressed to the end face of the plate member.
申请公布号 US7152854(B2) 申请公布日期 2006.12.26
申请号 US20040887394 申请日期 2004.07.07
申请人 OLYMPUS CORPORATION 发明人 UCHIDA JUNICHI
分类号 F16F1/06;F16F1/12;F16F1/08;F16F3/02;F16F3/04;H01M2/10 主分类号 F16F1/06
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