发明名称 HEIGHT ADJUSTMENT MECHANISM FOR ELECTRONIC EQUIPMENT
摘要 A height adjustment mechanism for electronic equipment is disclosed. The height adjustment mechanism includes a first sliding component (103A) that includes a first set of mechanical structures (303) for engaging a second set of mechanical structures, a first mechanical sub-component (201) coupled to the first sliding component and coupled to a second mechanical sub-component (301) that includes the second set of mechanical structures and a second sliding component (103B) coupled to the first sliding component. The first set of mechanical structures (303) and the second set of mechanical structures are configured to mesh. A movement of the first sliding component causes either an expansion or a retraction of the first mechanical sub-component.
申请公布号 WO2006133386(A1) 申请公布日期 2006.12.14
申请号 WO2006US22393 申请日期 2006.06.06
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;BLIVEN, ROBERT 发明人 BLIVEN, ROBERT
分类号 F16M11/24 主分类号 F16M11/24
代理机构 代理人
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