发明名称 |
HEIGHT ADJUSTMENT MECHANISM FOR ELECTRONIC EQUIPMENT |
摘要 |
A height adjustment mechanism for electronic equipment is disclosed. The height adjustment mechanism includes a first sliding component (103A) that includes a first set of mechanical structures (303) for engaging a second set of mechanical structures, a first mechanical sub-component (201) coupled to the first sliding component and coupled to a second mechanical sub-component (301) that includes the second set of mechanical structures and a second sliding component (103B) coupled to the first sliding component. The first set of mechanical structures (303) and the second set of mechanical structures are configured to mesh. A movement of the first sliding component causes either an expansion or a retraction of the first mechanical sub-component. |
申请公布号 |
WO2006133386(A1) |
申请公布日期 |
2006.12.14 |
申请号 |
WO2006US22393 |
申请日期 |
2006.06.06 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;BLIVEN, ROBERT |
发明人 |
BLIVEN, ROBERT |
分类号 |
F16M11/24 |
主分类号 |
F16M11/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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