发明名称 HEAT-CURABLE SILICONE RUBBER ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a heat-curable silicone rubber adhesive composition maintaining curing stability after storage, providing a cured product having good heat-stability, and having good adhesion even to a resin with poor adhesion. SOLUTION: The heat-curable silicone rubber adhesive composition comprises (A) an organopolysiloxane having two or more alkenyl groups bound to a silicon atom in one molecule represented by the formula: R<SP>1</SP><SB>a</SB>R<SP>2</SP><SB>b</SB>SiO<SB>(4-a-b)/2</SB>(wherein R<SP>1</SP>denotes a monovalent hydrocarbon group; R<SP>2</SP>denotes an alkenyl group; a is 0.96-2.00; b is 0.001-0.5; and a+b=1.00-2.04), (B) an organohydrogenpolysiloxane represented by the formula: R<SP>3</SP><SB>c</SB>H<SB>d</SB>SiO<SB>(4-c-d)/2</SB>(R<SP>3</SP>is the same as R<SP>1</SP>; c is 0.70-2.0; d is 0.01-1.2; and c+d=0.8-3.0), (C) a platinum metal compound, (D) a curing controlling agent, (E) an addition-curable functional group-containing alkoxysilane, an organosiloxane containing an addition-curable functional group and an alkoxy group, or an isocyanurate compound containing an addition-curable functional group and an alkoxysilyl group, (F) a zirconium compound, and (G) a carboxylic acid anhydride. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006335854(A) 申请公布日期 2006.12.14
申请号 JP20050161512 申请日期 2005.06.01
申请人 SHIN ETSU CHEM CO LTD 发明人 HARA HIROYASU;AKEDA TAKASHI
分类号 C09J183/04;C09J11/00;C09J183/05;C09J183/07 主分类号 C09J183/04
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