| 摘要 |
In a semiconductor device, ESD damage countermeasures are taken for a signal terminal of one power supply system, with a power supply (or grounding) terminal of other power supply system as a reference. The semiconductor device suppresses chip size increase caused by the countermeasures, while taking such countermeasures. The semiconductor device (1) is provided with ESD protection bonding pads (36-39) connected with the power supply terminals (10, 13) and grounding terminals (12, 15) with bonding wires (26-29) in the first and second power supply systems, ESD protection element parts (41a, 42a) for each signal, which are connected with signal bonding pads (31, 34) and the ESD protection bonding pads (36-39) to protect input/output circuits (43, 44), and a power supply ESD protection element part (40a), which is connected with the ESD protection bonding pads (36, 37). |
