| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing apparatus in which processing can be uniformly performed all over a wafer by devising rotational driving of the wafer, and further, time for the treatment can be shortened. SOLUTION: Since a holding mechanism 29 is rotated by operating a motor around a virtual horizontal axis VP away from the virtual horizontal axis VP just for a predetermined distance, not only a periphery of a wafer W but also its central part similarly performs rotational movement drawing a circle around the virtual horizontal axis VP. Furthermore, since auto-rotation movement is performed around a gear 40, adverse effect of non-uniformity can be avoided in the flow of a processing liquid that may occur in an inner tub 1. Therefore, the processing liquid can be uniformly contacted all over the wafer W. COPYRIGHT: (C)2007,JPO&INPIT |
