| 摘要 |
The present invention provides an aqueous solution composition for treating copper surface to improve adhesion of organic polymer with copper surface, characterized in that, said aqueous solution composition comprises water-soluble persulfate and the pH of said composition is from 11-14. The present invention further provides a method for improving the adhesion of organic polymer with copper surface by treating said copper surface and a method for preparing an article having a copper surface which is coated with organic polymer coating. The present composition and method are applicable to the adhesion of any polymer coatings, especially, epoxy, phenolic aldehyde, melamine and polyurea resin on copper surface. |
