发明名称 |
POLISHING PAD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
A polishing pad capable of maintaining high-precision end-point optical detection over a long period from the start of the use to the end of the use even if polishing is preformed with an alkaline or acid slurry and a method for manufacturing a semiconductor device using this polishing pad are disclosed. The polishing pad is used for chemical mechanical polishing and has a polishing region and a light-transmitting region. If T1 is the light transmittance (%) of the light-transmitting region measured to the measurement wavelength lambda after the polishing pad is dipped in a KOH aqueous solution of pH 11 or an H2O2aqueous solution of pH 4 for 24 hours and T0 is the light-transmittance (%) measured to the measurement wavelength lambda before the dipping, the difference DeltaT(DeltaT=T0-T1) (%) between T 0 and T1 is within 10 (%) over the whole range of the measurement wavelength from 400 to 700 nm.
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申请公布号 |
KR20060118010(A) |
申请公布日期 |
2006.11.17 |
申请号 |
KR20067019174 |
申请日期 |
2006.09.18 |
申请人 |
TOYO TIRE & RUBBER CO., LTD. |
发明人 |
SHIMOMURA TETSUO;NAKAMORI MASAHIKO;YAMADA TAKATOSHI;OGAWA KAZUYUKI;KAZUNO ATSUSHI;WATANABE MASAHIRO |
分类号 |
H01L21/304;B24B37/04;B24B37/20;H01L21/306 |
主分类号 |
H01L21/304 |
代理机构 |
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