| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a carrier for a double-side polishing apparatus for enabling the production of a high quality wafer having high flatness by highly efficient double-side polishing which causes no metallic contamination to a wafer upon double-side polishing of the wafer and has good durability. <P>SOLUTION: This carrier for the double-side polishing apparatus is provided between upper and lower polishing plates to each of which a polishing cloth being stuck in the double-side polishing apparatus, and is formed with a retaining hole for retaining the semiconductor wafer sandwiched between the upper and lower polishing plates upon polishing. The material of the matrix of the carrier is a resin, and the carrier is formed by coating the surface of the matrix with a DLC film. <P>COPYRIGHT: (C)2007,JPO&INPIT |
