| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaging method and a packaging structure of a semiconductor device in which reliability of packaging is enhanced and high density mounting can be achieved, and to provide a semiconductor device suitable for use therein. <P>SOLUTION: The packaging method of a semiconductor device performing face down bonding of a semiconductor chip 2 having a bump 3 onto a substrate 7 having a conductive part 8 comprises a step for forming a photosensitive and adhesive resin layer 5 on the bump forming surface of the semiconductor chip 2, a step for exposing the upper surface of the bump 3 by exposing and developing the resin layer 5 thereby removing resin from immediately above the bump 3, and a step for conducting the bump 3 of the semiconductor chip 2 and the conductive part 8 of the substrate 7 electrically by performing face down bonding of the semiconductor chip 2 applied with a resin film 6 composed of the resin layer 5 onto the substrate 7 thereby making the resin film 6 function as adhesive. <P>COPYRIGHT: (C)2007,JPO&INPIT |
