发明名称 LAMINATED COOLER
摘要 PROBLEM TO BE SOLVED: To provide a laminated cooler which keeps small its dimension in its lamination direction, and can hold many electronic components while maintaining its cooling performance. SOLUTION: In the laminated cooler 1, each electronic component 4 is cooled through both its surfaces, and there are provided a plurality of cooling tubes 2 between respective upper and lower ones of which each electronic component 4 is interposed and cooled. The plurality of cooling tubes 2 are subjected to lamination and fixations by a refrigerant feeding header 3A for feeding a refrigerant 5 to the plurality of cooling tubes 2, and by refrigerant exhausting headers 3B for exhausting the refrigerant 5 from the plurality of cooling tubes 2. The refrigerant exhausting headers 3B are disposed in both the ends of each of the plurality of cooling tubes 2 which is present in a refrigerant passing direction L. The refrigerant feeding header 3A is disposed in the central portion between both the ends of each of the plurality of cooling tubes 2 which is present in the refrigerant passing direction L. Respective upper and lower ones of the plurality of cooling tubes 2 are so constituted as to perform the sandwiching of each electronic component 4 in each place between the refrigerant feeding header 3A and the refrigerant exhausting header 3B which is in the refrigerant passing direction L. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006294920(A) 申请公布日期 2006.10.26
申请号 JP20050114666 申请日期 2005.04.12
申请人 DENSO CORP 发明人 ABEI ATSUSHI;INAGAKI MITSUHARU;MIYAJIMA NORIYOSHI
分类号 H01L23/40;H01L23/473 主分类号 H01L23/40
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