HEAT RELEASE SHEET

摘要

PROBLEM TO BE SOLVED: To provide a heat release sheet (for electronic equipment/electric components) having thin film thickness of sheet and good heat release property and to provide a method for producing the heat release sheet. SOLUTION: The heat release sheet is obtained by binding magnesium oxide particles with a binder resin having -50 to 50°C glass transition temperature. In the heat release sheet, the mass ratio of magnesium oxide particles/binder resin is (75/25) to (91/9) and sheet thickness is 50-150μm. The method for producing the heat release sheet comprises applying a coating liquid obtained by uniformly and finely dispersing magnesium oxide to a solution obtained by dissolving the binder resin into a solvent onto a film and drying the coated liquid to form a sheet. COPYRIGHT: (C)2006,JPO&NCIPI