| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for transferring a substrate from the grinding stage to the cleaning stage, the method that reduces minute particles firmly adhering to a grinding mark groove of a back ground semiconductor substrate. SOLUTION: The surface of the substrate with a printed wiring is coated by a protective tape. The protective tape side of the semiconductor substrate is disposed in face to face with a porous ceramic chuck 12, and the backside of the substrate is polished by grinding stones 16a, 16b. On completion of grinding, an annular suction pad open above and below on a conveyor is brought into contact with the backside of the polished substrate, while feeding washing liquid 60 onto the polished substrate on its backside. The substrate is shifted to a washing spinner 10 with the washing liquid film existent inside a recessed gap formed by the upper face of the substrate and the lower face of the annular sucking pad. As the substrate is conveyed with its polishing surface kept wet, fine particles can be prevented from getting fixed and can be removed easily during spin washing. COPYRIGHT: (C)2006,JPO&NCIPI |
