| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board which can reduce transmission loss and achieve enough adhesion between a metal supporting board and a metal foil by a simplified layer structure and which can ensure superior long-term reliability. SOLUTION: A metal supporting board 2 is prepared, and a metallic thin film 3 is formed thereon by sputtering or electrolytic plating. A metal foil 4 is formed on the metallic thin film 3 by electrolytic plating, and a base insulating layer 5 is formed on the metal foil 4 and the metal supporting board 2. Then, a conductor pattern 6 is formed as a wiring circuit pattern on the base insulating layer 5, and a cover insulating layer 7 is formed on the base insulating layer 5 so as to cover the conductor pattern 6. COPYRIGHT: (C)2006,JPO&NCIPI
|
