发明名称 |
Mold cleaning sheet and method of producing semiconductor devices using the same |
摘要 |
A cleaning sheet ( 29 ) is formed with a trough-hole ( 29 a) at a portion corresponding to a cavity of a mold along with a slit ( 29 b) or a flow cavity cut ( 29 c) at every corner at an outer periphery of the through-hole ( 29 a) and is placed between a first mold half and a second mold half of the mold to clean the inside of the mold, thereby improving the cleaning effect of the mold. |
申请公布号 |
US2006197258(A1) |
申请公布日期 |
2006.09.07 |
申请号 |
US20060431508 |
申请日期 |
2006.05.11 |
申请人 |
CORP AND HITACHI YONEZAWA ELECTRONICS CO., LTD. |
发明人 |
TSUCHIDA KIYOSHI |
分类号 |
H01L21/56;B29C33/72;B29C45/14;B29C45/17 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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