发明名称 Mold cleaning sheet and method of producing semiconductor devices using the same
摘要 A cleaning sheet ( 29 ) is formed with a trough-hole ( 29 a) at a portion corresponding to a cavity of a mold along with a slit ( 29 b) or a flow cavity cut ( 29 c) at every corner at an outer periphery of the through-hole ( 29 a) and is placed between a first mold half and a second mold half of the mold to clean the inside of the mold, thereby improving the cleaning effect of the mold.
申请公布号 US2006197258(A1) 申请公布日期 2006.09.07
申请号 US20060431508 申请日期 2006.05.11
申请人 CORP AND HITACHI YONEZAWA ELECTRONICS CO., LTD. 发明人 TSUCHIDA KIYOSHI
分类号 H01L21/56;B29C33/72;B29C45/14;B29C45/17 主分类号 H01L21/56
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