发明名称 |
Conductive powder and method for preparing the same |
摘要 |
Disclosed are conductive powder having a packing density of 68% by volume or more with a relative value preferably comprising 60 to 92% by weight of roughly spherical and silver-plated copper powder part of the surface of which has been coated with 3 to 30% by weight of silver based on an amount of roughly spherical copper powder with exposing at least a surface of a portion of an alloy of copper with silver, and the surface of which is coated with 0.02 to 1.0% by weight of an aliphatic acid based on an amount of the roughly spherical and silver-plated copper powder, and 8 to 40% by weight of silver powder, and a method for preparing the same.
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申请公布号 |
US7083859(B2) |
申请公布日期 |
2006.08.01 |
申请号 |
US20040885478 |
申请日期 |
2004.07.07 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
KUWAJIMA HIDEJI |
分类号 |
B22F1/02;H01B1/02;B22F1/00;B32B15/02;H01B1/22;H05K1/09;H05K3/32 |
主分类号 |
B22F1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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