发明名称 |
A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE |
摘要 |
In a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed. |
申请公布号 |
KR20060086499(A) |
申请公布日期 |
2006.08.01 |
申请号 |
KR20030045435 |
申请日期 |
2003.07.04 |
申请人 |
HITACHI, LTD.;KABUSHIKI KAISHA RENESAS KITA NIPON SEMICONDUCTOR |
发明人 |
FUJISAWA ATSUSHI;KONNO TAKAFUMI;OHSAKA SHINGO;HARUTA RYO;ICHITANI MASAHIRO |
分类号 |
H01L23/14;H01L23/28;H01L21/56;H01L23/31 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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