发明名称 CURING AQUEOUS RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an aqueous resin composition generating no formalin at the time of curing and from a cured matter obtained, and superior in thermal curing property. SOLUTION: The thermally curing aqueous resin composition comprises: an aqueous resin (A) obtained by polymerizing monomer components containing no monomer component having a carboxyl group (a-1), but containing an ethylenically unsaturated monomer containing a tertiary amino group (a-2), and an ethylenically unsaturated monomer containing a hydroxy group (a-3), in the presence of a carboxyl group-containing polymer (A') formed by polymerizing the monomer components (a-1) having carboxyl groups as indispensable components; a compound (B) containing a silanol group and/or a hydrolytic silyl group; and a polyisocyanate resin and/or a block polyisocyanate resin (C). COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006182860(A) 申请公布日期 2006.07.13
申请号 JP20040376231 申请日期 2004.12.27
申请人 DAINIPPON INK & CHEM INC 发明人 NAKAMURA KATSUYOSHI;SHIRAGA JUN
分类号 C08L51/06;C08F2/44;C08F265/00;C08K5/541;C08L75/04 主分类号 C08L51/06
代理机构 代理人
主权项
地址