发明名称 Method of manufacturing semiconductor device
摘要 A lower electrode of a capacitor element is formed by manufacturing a crown structure while using a first conducting material such as titanium nitride or the like excellent in mechanical strength as a base material and by forming a film of a second conducting material such as ruthenium or the like, which is comparatively difficult to be oxidized, on a surface of the crown structure. First, ruthenium is deposited on a surface of the crown structure by using a sputtering method. Thereafter, the ruthenium (sputtered ruthenium) placed in a peripheral region of the crown structure is removed by etching, and a film of ruthenium is further formed on a surface of the crown structure by using a CVD method while using the sputtered ruthenium as a seed layer.
申请公布号 US7071071(B2) 申请公布日期 2006.07.04
申请号 US20040801003 申请日期 2004.03.16
申请人 ELPIDA MEMORY, INC. 发明人 IIJIMA SHINPEI;KUROKI KEIJI
分类号 H01L21/8242;H01L21/02;H01L27/108 主分类号 H01L21/8242
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